πŸ“„ Technical Documents

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IGBT Product Selection Guide

Complete IGBT series selection guide and technical parameters

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SiC MOSFET Product Brochure

SiC series specifications, characteristics, and application notes

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Power Module User Guide

PIM and half-bridge module installation and usage instructions

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Driver IC Application Notes

Isolated driver IC typical application circuit design

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Thermal Design Guide

Power device thermal solution design and calculation

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Reliability Test Report

HTRB, H3TRB, TC test data summary

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❓ Frequently Asked Questions (FAQ)

How to choose the right IGBT model?

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When selecting an IGBT model, consider these key parameters: Operating voltage (VCES) should be 1.2-1.5 times the maximum system voltage; current (IC) should be selected based on load current and thermal conditions, typically with a 20%-30% margin; switching frequency affects loss distribution, and high-frequency applications should choose high-speed switching IGBTs. Please refer to our selection guide or contact technical support for professional recommendations.

What are the advantages of SiC MOSFET over IGBT?

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SiC MOSFET offers several advantages over IGBT: β‘  Lower switching losses β€” SiC MOSFET is a majority carrier device with no tail current, reducing switching losses by over 70%; β‘‘ Higher switching frequency β€” can reach 100kHz+, significantly reducing magnetic component size; β‘’ Higher operating temperature β€” junction temperature up to 175Β°C or even 200Β°C, with lower cooling requirements; β‘£ Higher efficiency β€” especially at light loads. However, cost is higher, and advantages are more pronounced in high-voltage, high-power applications.

What are the installation precautions for power modules?

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Power module installation notes: β‘  Heatsink flatness must be within 0.05mm, surface roughness Ra≀1.6ΞΌm; β‘‘ Thermal grease must be applied evenly, thickness controlled at 50-100ΞΌm; β‘’ Screw tightening torque must strictly follow specifications, using cross-diagonal step-by-step tightening; β‘£ Avoid bending or torsional stress on the module; β‘€ Thermal resistance testing is recommended after installation to verify heat dissipation.

How to request samples? What is the lead time?

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Sample request process: β‘  Submit a sample request form through the "Contact Us" page on our website, or send an email to info@luffycloud.com; β‘‘ Provide company information, application scenario, required model numbers, and quantities; β‘’ Our technical support team will contact you within 1-2 business days. Standard sample delivery time is 3-5 business days; customized parameter products are negotiated separately.

What is the product warranty policy?

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AGMsemi products carry a 24-month warranty from the date of delivery. Within the warranty period, quality issues caused by product design or manufacturing defects will be repaired or replaced free of charge. The following situations are not covered: β‘  Damage from use beyond maximum ratings in the datasheet; β‘‘ Damage from improper installation, operation, or storage; β‘’ Unauthorized disassembly or modification. Refer to our sales terms and conditions for details.

Do you provide reference designs and technical support?

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Yes, we provide comprehensive technical support services for key customers, including: β‘  Product selection recommendations and solution evaluation; β‘‘ Application circuit reference designs; β‘’ PCB layout guidance and thermal simulation analysis; β‘£ Prototype debugging and testing assistance; β‘€ Failure analysis (FA). For strategic partners, we also offer on-site technical support. Please contact sales@luffycloud.com or your account manager for support.

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